Ultra Large Scale Integration (ULSI) technology, which bundles millions or billions of micro-components onto a single die, is the hallmark of which generation? MCQ with Answer and Explanation
Ultra Large Scale Integration (ULSI) technology, which bundles millions or billions of micro-components onto a single die, is the hallmark of which generation?
A. Fifth Generation
B. Fourth Generation
C. Second Generation
D. Third Generation
Answer: Option A
Solution (By JKSSB Mock Tests)
ULSI technology is heavily aligned with the fifth generation, providing the astronomical circuit density needed for advanced AI processing.
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